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TE0820-03-03EG-1EL

TE0820-03-03EG-1EL

TE0820-03-03EG-1EL

Trenz Electronic GmbH

TE0820-03-03EG-1EL datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0820-03-03EG-1EL Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0820
Size / Dimension 1.57 x 1.97 40mmx50mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:3254 items

TE0820-03-03EG-1EL Product Details

TE0820-03-03EG-1EL Overview


The microcontroller has been classified as a MPU Core type module or board.It has Zynq UltraScale+ XCZU3EG-1SFVC784E cores and is driven by a processor.0°C~85°C is the default setting for the microcontroller.The size of the flash on the MCU electronics is 128MB.An B2B connector has a B2B connector type.The TE0820 Series is the group in which MCU chip belongs.This is done to make sure that the software is able to run normally and that the RAM size is reduced to 2GB.

TE0820-03-03EG-1EL Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB

TE0820-03-03EG-1EL Applications


There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1EL Microcontroller, Microprocessor, FPGA Modules applications.

  • Home and Building Automation
  • IoT Secure Gateways
  • Closed Loop Motor Control
  • Industrial Automation
  • Human Machine Control Panel
  • Thermostat
  • Data Acquisition
  • Software Defined Radio
  • Embedded User Interfaces
  • Industrial Instrumentation

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