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TE0820-03-03EG-1ED

TE0820-03-03EG-1ED

TE0820-03-03EG-1ED

Trenz Electronic GmbH

TE0820-03-03EG-1ED datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0820-03-03EG-1ED Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~80°C
Series TE0820
Size / Dimension 1.57 x 1.97 40mmx50mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:3230 items

TE0820-03-03EG-1ED Product Details

TE0820-03-03EG-1ED Overview


MPU Core is the type of module or board that is used in this microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, the processor drives microprocessor chip.It is default for the microcontroller to set the mode to 0°C~80°C.MCU chips flash size is 128MB.Microprocessor chip is a type B2B connector.In the TE0820 series, this is one of the microcontrollers.The RAM is reduced to 2GB in order to ensure that the software is able to run normally.

TE0820-03-03EG-1ED Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB

TE0820-03-03EG-1ED Applications


There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1ED Microcontroller, Microprocessor, FPGA Modules applications.

  • IoT Secure Gateways
  • Human Machine Interface
  • Portable Data Terminals
  • Medical Instrumentation
  • Healthcare Monitoring
  • Weighing Scales
  • Medical Devices
  • Embedded Instrumentation
  • Data Acquisition
  • Industrial Control

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