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TE0808-04-09EG-1EE

TE0808-04-09EG-1EE

TE0808-04-09EG-1EE

Trenz Electronic GmbH

TE0808-04-09EG-1EE datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0808-04-09EG-1EE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
RoHS StatusROHS3 Compliant
In-Stock:4541 items

Pricing & Ordering

QuantityUnit PriceExt. Price

TE0808-04-09EG-1EE Product Details

TE0808-04-09EG-1EE Overview


A MPU Core module or board is used in the microcontroller.Microprocessor chip is powered by a processor with a total of Zynq UltraScale+ XCZU9EG-1FFVC900E cores in it.0°C~85°C is the default setting for the microcontroller.128MB is the size of the flash on the MCU electronics.In this case, the connector type is B2B.There are two versions of this microcontrollers in the TE0808 Series.The RAM size has been reduced to 4GB in order to ensure that the software runs normally.

TE0808-04-09EG-1EE Features


Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash size of 128MB

TE0808-04-09EG-1EE Applications


There are a lot of Trenz Electronic GmbH TE0808-04-09EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.

  • Closed Loop Motor Control
  • Human Machine Interface
  • Embedded Control Processing
  • Process Control
  • Software Defined Radio
  • IoT Secure Gateways
  • Network Enabled Data Acquisition
  • Home and Building Automation
  • Human Machine Control Panel
  • Healthcare Monitoring

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