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TE0808-04-06EG-1E3

TE0808-04-06EG-1E3

TE0808-04-06EG-1E3

Trenz Electronic GmbH

TE0808-04-06EG-1E3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0808-04-06EG-1E3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU6EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
RoHS StatusROHS3 Compliant
In-Stock:1242 items

TE0808-04-06EG-1E3 Product Details

TE0808-04-06EG-1E3 Overview


In this case, the module or board type of the microcontroller is MPU Core.Processors with Zynq UltraScale+ XCZU6EG-1FFVC900E cores drive it.Microcontrollers are configured by default to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.B2B' stands for connector type.A member of the TE0808 Series, MCU chip has an LCD screen.Software runs normally with RAM size 4GB when the RAM size is reduced.

TE0808-04-06EG-1E3 Features


Core processor of Zynq UltraScale+ XCZU6EG-1FFVC900E
Flash size of 128MB

TE0808-04-06EG-1E3 Applications


There are a lot of Trenz Electronic GmbH TE0808-04-06EG-1E3 Microcontroller, Microprocessor, FPGA Modules applications.

  • Embedded Instrumentation
  • Network Enabled Data Acquisition
  • Medical Instrumentation
  • Patient Monitoring
  • Process Control
  • Medical Devices
  • Closed Loop Motor Control
  • Human Machine Control Panel
  • Weighing Scales
  • Data Acquisition

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