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TE0803-03-4DE11-A

TE0803-03-4DE11-A

TE0803-03-4DE11-A

Trenz Electronic GmbH

TE0803-03-4DE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-4DE11-A Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4EV-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:2805 items

TE0803-03-4DE11-A Product Details

TE0803-03-4DE11-A Overview


A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU4EV-1SFVC784E cores in the processor.In order to use the microcontroller, the default setting is 0°C~85°C.A MCU electronics's flash size is measured by the letter 128MB.An B2B connector has a B2B connector type.The MCUs is part of the TE0803 Series of products.The RAM size has been reduced to 2GB in order to ensure that the software runs normally.

TE0803-03-4DE11-A Features


Core processor of Zynq UltraScale+ XCZU4EV-1SFVC784E
Flash size of 128MB

TE0803-03-4DE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-4DE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Software Defined Radio
  • Patient Monitoring
  • Data Acquisition
  • Industrial Gateways
  • Medical Instrumentation
  • Medical Devices
  • Embedded User Interfaces
  • Human Machine Control Panel
  • Thermostat
  • Process Control

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