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TE0803-03-2BE11-A

TE0803-03-2BE11-A

TE0803-03-2BE11-A

Trenz Electronic GmbH

TE0803-03-2BE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-2BE11-A Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:3522 items

TE0803-03-2BE11-A Product Details

TE0803-03-2BE11-A Overview


MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU2EG-1SFVC784E cores, the processor drives microprocessor chip.0°C~85°C is the default setting for the microcontroller.There is a flash size 128MB on the MCU electronics.Connector type B2B refers to the type of connector.I would say that MCU chip belongs to the TE0803 Series.A minimum RAM size of 2GB is set to enable the software to run normally.

TE0803-03-2BE11-A Features


Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E
Flash size of 128MB

TE0803-03-2BE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-2BE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Software Defined Radio
  • Bar Code Scanners
  • Human Machine Control Panel
  • Patient Monitoring
  • Weighing Scales
  • Process Monitoring
  • Process Control
  • Embedded Control Processing
  • Human Machine Interface
  • Industrial Gateways

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