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TE0803-03-2AE11-A

TE0803-03-2AE11-A

TE0803-03-2AE11-A

Trenz Electronic GmbH

TE0803-03-2AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-2AE11-A Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:1182 items

TE0803-03-2AE11-A Product Details

TE0803-03-2AE11-A Overview


The module or board type of the microcontroller is MPU Core.With Zynq UltraScale+ XCZU2CG-1SFVC784E cores, microprocessor chip is powered by a processor.The microcontroller is set to 0°C~85°C by default, which is the default setting.There is a 128MB size to the MCU electronics's flash.B2B is the connector type.The TE0803 Series is the group in which MCU chip belongs.This is 2GB in order to guarantee that the software runs normally.

TE0803-03-2AE11-A Features


Core processor of Zynq UltraScale+ XCZU2CG-1SFVC784E
Flash size of 128MB

TE0803-03-2AE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-2AE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Human Machine Control Panel
  • Data Acquisition
  • Patient Monitoring
  • Bar Code Scanners
  • Industrial Gateways
  • Process Monitoring
  • Embedded User Interfaces
  • Network Enabled Data Acquisition
  • IoT Secure Gateways
  • Industrial Control

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