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TE0803-02-04CG-1EA

TE0803-02-04CG-1EA

TE0803-02-04CG-1EA

Trenz Electronic GmbH

TE0803-02-04CG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-02-04CG-1EA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Operating Temperature0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part StatusObsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
In-Stock:1525 items

TE0803-02-04CG-1EA Product Details

TE0803-02-04CG-1EA Overview


MPU Core is the type of module or board that is used in this microcontroller.Processors with Zynq UltraScale+ XCZU4CG-1SFVC784E cores drive it.In order to use the microcontroller, the default setting is 0°C~85°C.This MCU electronics has a size of 128MB in terms of its flash.B2B' stands for connector type.In the TE0803 series, this is one of the microcontrollers.This is done to make sure that the software is able to run normally and that the RAM size is reduced to 2GB.

TE0803-02-04CG-1EA Features


Core processor of Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash size of 128MB

TE0803-02-04CG-1EA Applications


There are a lot of Trenz Electronic GmbH TE0803-02-04CG-1EA Microcontroller, Microprocessor, FPGA Modules applications.

  • Data Acquisition
  • Human Machine Control Panel
  • Industrial Control
  • Medical Devices
  • Power Protection Systems
  • Software Defined Radio
  • Embedded Instrumentation
  • Portable Data Terminals
  • Patient Monitoring
  • Embedded User Interfaces

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