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TLP170D(TP,F)

TLP170D(TP,F)

TLP170D(TP,F)

Toshiba Semiconductor and Storage

TLP170D(TP,F) datasheet pdf and Solid State Relays product details from Toshiba Semiconductor and Storage stock available on our website

SOT-23

TLP170D(TP,F) Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 4-SOP (0.173, 4.40mm)
Number of Pins 4
PackagingTape & Reel (TR)
Published 2009
Series TLP170D
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Termination Gull Wing
Resistance 8Ohm
Termination Style Gull Wing
Output Type AC, DC
Max Output Current200mA
Circuit SPST-NO (1 Form A)
Number of Channels 1
Voltage - Input 1.15VDC
Throw Configuration SPST
Max Output Voltage200V
Max Input Voltage 1.3V
Relay Type Relay
Voltage - Load 0V~200V
On-State Resistance (Max) 8Ohm
Max Input Current 50mA
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:7880 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About TLP170D(TP,F)

The TLP170D(TP,F) from Toshiba Semiconductor and Storage is a high-performance microcontroller designed for a wide range of embedded applications. This component features TLP170D(TP,F) datasheet pdf and Solid State Relays product details from Toshiba Semiconductor and Storage stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the TLP170D(TP,F), including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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