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CUS15S40,H3F

CUS15S40,H3F

CUS15S40,H3F

Toshiba Semiconductor and Storage

Diode Schottky 40V 2-Pin SOD-323

SOT-23

CUS15S40,H3F Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingSilver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case SC-76, SOD-323
Number of Pins 2
PackagingTape & Reel (TR)
Published 2014
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Max Operating Temperature125°C
Min Operating Temperature -55°C
Element ConfigurationSingle
Speed Fast Recovery =< 500ns, > 200mA (Io)
Diode Type Schottky
Current - Reverse Leakage @ Vr 200μA @ 40V
Voltage - Forward (Vf) (Max) @ If 450mV @ 1A
Operating Temperature - Junction 125°C Max
Max Reverse Voltage (DC) 40V
Average Rectified Current1.5A
Peak Reverse Current200μA
Max Repetitive Reverse Voltage (Vrrm) 40V
Capacitance @ Vr, F 170pF @ 0V 1MHz
Peak Non-Repetitive Surge Current 5A
RoHS StatusRoHS Compliant
In-Stock:17058 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.330000$0.33
10$0.311321$3.11321
100$0.293699$29.3699
500$0.277074$138.537
1000$0.261391$261.391

About CUS15S40,H3F

The CUS15S40,H3F from Toshiba Semiconductor and Storage is a high-performance microcontroller designed for a wide range of embedded applications. This component features Diode Schottky 40V 2-Pin SOD-323.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CUS15S40,H3F, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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