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74HCT244D

74HCT244D

74HCT244D

Toshiba Semiconductor and Storage

IC BUF NON-INVERT 5.5V 20SOIC

SOT-23

74HCT244D Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 20-SOIC (0.295, 7.50mm Width)
Surface MountYES
Operating Temperature-40°C~85°C TA
PackagingCut Tape (CT)
Published 2016
Series 74HCT
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
Technology CMOS
Voltage - Supply 4.5V~5.5V
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 2
Supply Voltage 5V
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Output Type 3-State
Number of Elements 2
Supply Voltage-Max (Vsup) 5.5V
Number of Ports2
Family HCT
Current - Output High, Low 6mA 6mA
Logic Type Buffer, Non-Inverting
Output Polarity TRUE
Number of Bits per Element 4
Width 7.5mm
RoHS StatusRoHS Compliant
In-Stock:9178 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.639618$0.639618
10$0.603413$6.03413
100$0.569258$56.9258
500$0.537036$268.518
1000$0.506637$506.637

About 74HCT244D

The 74HCT244D from Toshiba Semiconductor and Storage is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC BUF NON-INVERT 5.5V 20SOIC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 74HCT244D, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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