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CY74UTFCT163374CPAC

CY74UTFCT163374CPAC

CY74UTFCT163374CPAC

TEXASINSTRUMENTSINC

CY74UTFCT163374CPAC datasheet pdf and Accessories product details from TEXASINSTRUMENTSINC stock available on our website

SOT-23

CY74UTFCT163374CPAC Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 7 months ago)
Lifecycle Status 21 Weeks
Mount -
Mounting Type Surface Mount
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 7
Operating Temperature -
Packaging Box
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 5
ECCN Code -
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Regulators
Voltage - Supply 20V ~ 50V
Base Part Number Hwjnsn Lpndp
Output Voltage 43 V
Output Type P-Channel
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 80 μA
Nominal Supply Current -
Output Current 90 mA
Max Supply Current 1.5 mA
Slew Rate 0.3V/μs
Architecture VOLTAGE-FEEDBACK
Amplifier Type General Purpose
In-Stock:4195 items

About CY74UTFCT163374CPAC

The CY74UTFCT163374CPAC from TEXASINSTRUMENTSINC is a high-performance microcontroller designed for a wide range of embedded applications. This component features CY74UTFCT163374CPAC datasheet pdf and Accessories product details from TEXASINSTRUMENTSINC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CY74UTFCT163374CPAC, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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