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TPS2321IPWG4

TPS2321IPWG4

TPS2321IPWG4

Texas Instruments

2 Hot Swap Controllers TSSOP 2

SOT-23

TPS2321IPWG4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case TSSOP
Number of Pins 16
Weight 61.887009mg
JESD-609 Code e4
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Subcategory Power Management Circuits
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 4.5V
Depth 4.5mm
Pin Count16
Temperature GradeINDUSTRIAL
Number of Channels 2
Max Supply Voltage13V
Min Supply Voltage3V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Nominal Supply Current200μA
Adjustable Threshold YES
Voltage - Output 21V
Nominal Input Voltage13V
Length 5mm
Width 4.4mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:2960 items

TPS2321IPWG4 Product Details

TPS2321IPWG4 Overview


As part of the TSSOP package, it is included.2 channels are currently available.16 terminations are present in total.Its terminal position is DUAL.In total, it has 16 pins.High efficiency is possible at a voltage of 4.5V.A 16 pin is used for operation.Power Management Circuits contains this gadget all by itself.The position of the object is in the direction of Surface Mount.For stable operation, 85°C°C is the maximum operating temperature.For reliability, it must work at a minimum temperature of -40°C degrees Celsius.An analog IC, in this case POWER SUPPLY SUPPORT CIRCUIT, is used in this gadget.13VV is the maximum supply voltage it can handle.With a 3VV supply voltage, it can work as low as possible.

TPS2321IPWG4 Features


The terminal position of 16


TPS2321IPWG4 Applications


There are a lot of Texas Instruments
TPS2321IPWG4 hot swap controllers applications.


  • Networking
  • Telecommunications
  • Industrial
  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure

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