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TPS2231PWG4

TPS2231PWG4

TPS2231PWG4

Texas Instruments

1 Hot Swap Controllers TSSOP 1

SOT-23

TPS2231PWG4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case TSSOP
Surface MountYES
Number of Pins 20
Weight 76.997305mg
JESD-609 Code e4
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 20
ECCN Code EAR99
Resistance 45mOhm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Power Rating 704mW
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch0.65mm
Pin Count20
Number of Outputs 1
Temperature GradeINDUSTRIAL
Supply Voltage-Min (Vsup) 3V
Number of Channels 1
Interface Parallel
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Adjustable Threshold NO
Nominal Input Voltage3.6V
Min Current Limit 2.5A
Height 1mm
Length 6.5mm
Width 4.4mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:4992 items

TPS2231PWG4 Product Details

TPS2231PWG4 Overview


You get it with the TSSOP package.Currently, 1 channels can be accessed.Hot-swappable device terminates wHot-swappable deviceh 20 in total.Device DUAL is in the terminal position.Total number of pins is 20.High efficiency can be achieved with a voltage supply of 3.3V.Operating the device requires 20 pins.Stable operation can be achieved with a maximum operating temperature of 85°C°C.Hot-swappable device operates at a minimum temperature of -40°C degrees Celsius in order to ensure reliabilHot-swappable devicey.To ensure normal operation, the supply voltage (Vsup) must be kept above 3V.An analog IC, POWER SUPPLY SUPPORT CIRCUIT in this instance, is used for this gadget.Hot Swap is defaulted to output 1.Resistance to 45mOhm is present in the device.

TPS2231PWG4 Features


The terminal position of 20


TPS2231PWG4 Applications


There are a lot of Texas Instruments
TPS2231PWG4 hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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