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TPS2066DGN-1G4

TPS2066DGN-1G4

TPS2066DGN-1G4

Texas Instruments

1 Hot Swap Controllers HTSSOP EP 1

SOT-23

TPS2066DGN-1G4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case HTSSOP EP
Number of Pins 8
JESD-609 Code e4
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch0.65mm
Pin Count8
Number of Outputs 2
Temperature GradeINDUSTRIAL
Number of Channels 1
Max Supply Voltage5.5V
Min Supply Voltage2.7V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Adjustable Threshold NO
Nominal Input Voltage5.5V
Length 3mm
Height Seated (Max) 1.07mm
Width 3mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:3881 items

TPS2066DGN-1G4 Product Details

TPS2066DGN-1G4 Overview


The HTSSOP EP package contains it.Hot-swappable device is currently possible to access 1 channels.There are 8 terminations in total.This device has a terminal position of DUAL.8 pins make up its total.High efficiency can be achieved when the supply voltage is 3.3V.8 pins are used to operate the system.Surface Mount is its direction of movement.Hot-swappable device is stable to operate at a temperature of 85°C°C at the maximum.Hot-swappable device works at a minimum temperature of -40°C degrees Celsius to maintain reliabilHot-swappable devicey.There is a POWER SUPPLY SUPPORT CIRCUIT IC in this gadget, which is an analog IC.The default setting is output 2.Maximum supply voltage is 5.5VV.Low supply voltages, such as 2.7VV, can be used.

TPS2066DGN-1G4 Features


The terminal position of 8


TPS2066DGN-1G4 Applications


There are a lot of Texas Instruments
TPS2066DGN-1G4 hot swap controllers applications.


  • Telecommunications
  • Industrial
  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes

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