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TPS2053ADRG4

TPS2053ADRG4

TPS2053ADRG4

Texas Instruments

Tape & Reel (TR) Hot Swap Controllers SOIC

SOT-23

TPS2053ADRG4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 16
Weight 141.690917mg
PackagingTape & Reel (TR)
JESD-609 Code e4
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
ECCN Code EAR99
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature 0°C
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 3
Terminal Pitch1.27mm
Pin Count16
Number of Outputs 3
Temperature GradeOTHER
Max Supply Voltage5.5V
Min Supply Voltage2.7V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Length 9.9mm
Height Seated (Max) 1.75mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:3041 items

TPS2053ADRG4 Product Details

TPS2053ADRG4 Overview


Package SOIC includes it.Tape & Reel (TR)-shaped packaging is used for this product.This device has a total of 16 terminations.A device's terminal position is DUAL.16 pins make up the entire device.This device operates by using 16 pins.There is a Surface Mount axis pointing in the direction of the object.In order to ensure stable operation, a maximum operating temperature of 85°C°C must be set.Hot-swappable device maintains Hot-swappable devices reliabilHot-swappable devicey at a minimum working temperature of 0°C degrees Celsius.Hot Swap uses an analog IC, in this case a POWER SUPPLY SUPPORT CIRCUIT.As a default, it's set to output 3.5.5VV is the maximum supply voltage that it can handle.Using low supply voltages, such as 2.7VV, is feasible.

TPS2053ADRG4 Features


The terminal position of 16


TPS2053ADRG4 Applications


There are a lot of Texas Instruments
TPS2053ADRG4 hot swap controllers applications.


  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems
  • Redundant negative voltage supplies
  • Central office switching systems
  • Power supply hotswap & inrush control

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