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TMDXEVM6657L
Texas Instruments
TMDXEVM6657L datasheet pdf and Evaluation Boards - Embedded - MCU, DSP product details from Texas Instruments stock available on our website
SOT-23
TMDXEVM6657L Datasheet PDF
non-compliant
| Parameter Name | Value |
|---|---|
| Type | Parameter |
| Mounting Type | Fixed |
| Package / Case | Module |
| Series | KeyStone |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | DSP |
| Base Part Number | TMDXEVM66 |
| Operating Supply Voltage | 12V |
| Interface | RS-232 |
| Core Processor | C66x |
| Utilized IC / Part | TMS320C6657 |
| Evaluation Kit | Yes |
| Core Architecture | C6000 |
| Contents | Board(s) |
| Board Type | Evaluation Platform |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
The TMDXEVM6657L Lite Evaluation Modules (EVM), which are simple to use and reasonably priced development tools, assist designers in getting up and running with designs utilizing the C6657, C6655, or C6654 family of DSPs. Customers can employ this AMC form factor card in different systems because of the EVMs' on-board single C6657 CPU and wide range of connectivity choices. They can also be used independently. The Code Composer StudioTM Integrated Development Environment version 5 (CCS v5), the Multicore Software Development Kit (MCSDK), the Board Support Package (BSP), the Chip Support Library (CSL), the Power On Self Test (POST), the Network Development Kit (NDK), the SYSBIOS, and the Out of Box (OOB) Demonstration software are all included in the software that comes with the 6657L EVM. The XDS100 onboard emulation capability is a feature of the TMDSEVM6657L EVM. Moreover, a third-party emulator can be used by using the JTAG emulation header. TMDXEVM6657LE DETAILS: The TMS320C6657 Lightweight Evaluation Modules (EVM), which are simple to use and reasonably priced development tools, assist designers in getting up and running with designs utilizing the C6657, C6655, or C6654 family of DSPs. Customers can employ this AMC form factor card in different systems because to the EVMs' on-board single C6657 CPU and wide range of connectivity choices. They can also be used independently. The Code Composer StudioTM Integrated Development Environment version 5 (CCS v5), the Multicore Software Development Kit (MCSDK), the Board Support Package (BSP), the Chip Support Library (CSL), the Power On Self Test (POST), the Network Development Kit (NDK), the SYSBIOS, and the Out of Box (OOB) Demonstration software are all included in the software that comes with the 6657L EVM. The XDS560V2 onboard emulation capability is a feature of the TMDSEVM6657LE EVM. The TI 60-pin JTAG emulation header is used by the XDS560 mezzanine card that is provided.
RS232 Serial interface on 3-Pin header or UART over mini-USB connector
UPP, Timer, SPI, McBSP, UART interfaces on 80-pin expansion header
On-Board XDS100 type Emulation using USB 2.0 interface
TI 60-Pin JTAG header to support External Emulator
High Speed Integrated XDS560v2 Mezzanine Emulator
High Speed Integrated XDS200 Mezzanine Emulator
Module Management Controller (MMC) for Intelligent Platform Management Interface (IPMI)
Powered by DC power-brick adaptor (12V/2.5A) or AMC Carrier back-plane
PICMG® AMC.0 R2.0 single width, full height AdvancedMC module
Texas Instruments' fixed point DSP - TMS320C6657
512 Mbytes of DDR3 Memory (up to 1024Mbytes supported)
128 Mbytes of NAND Flash
16 Mbytes of NOR Flash
One Gigabit Ethernet port supporting 10/100/1000 Mbps data rate – switched between RJ-45 connector and AMC fingers
170 pin B+ style AMC Interface
High performance connector for HyperLink
128 kbytes I2C EEPROM for booting
4 User Indication LEDs, 4 Software Controlled LEDs and 3 User DIP Switches
Audio signal
Speech processing
RADAR
Seismology
Audio
SONAR
Voice recognition
Some financial signals. For example, digital signal processing is used for speech compression for mobile phones, as well as speech transmission for mobile phones.
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