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TLK2711HFG/EM

TLK2711HFG/EM

TLK2711HFG/EM

Texas Instruments

68 Terminations68 Pin TLK2711 Receivers16/16 Drivers/Receivers1 Functions

SOT-23

TLK2711HFG/EM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Surface MountYES
Number of Pins 68
Operating Temperature-40°C~85°C
Part StatusDiscontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 68
Type Transceiver
HTS Code8542.39.00.01
Voltage - Supply 2.3V~2.7V
Terminal Position QUAD
Terminal FormFLAT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch0.64mm
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number TLK2711
Number of Drivers/Receivers 16/16
Height 2.68mm
Length 13.97mm
Width 13.97mm
Thickness 2.29mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:3199 items

TLK2711HFG/EM Product Details

TLK2711HFG/EM Overview


Since this part is a Transceiver can transceiver, a number of solutions have been able to utiliTransceivere it for various purposes.Power supply requirements for this differential driver are 2.3V~2.7V.It is possible to have up to 16/16 receivers/drivers in use simultaneously with this electronic part.IC receiver's like this are designed for applications requiring a -40°C~85°C operating temperature.This line driver ic can operate efficiently with a supply voltage range of 2.5V.In this wide receiver, 68 terminations are integrated for driving and receiving signals from data.Since the base part number TLK2711 uniquely identifies the product type, temperature, package, etc., you can use it to find more variations.Wide receiver with enhanced power dissipation control, 68-pin.

TLK2711HFG/EM Features


68 pins

TLK2711HFG/EM Applications


There are a lot of Texas Instruments TLK2711HFG/EM Drivers/Receivers/Transceivers applications.

  • Datacom networking applications
  • Wireless projection application for conferences
  • Wireless communication
  • Gigabit Ethernet
  • Wireless smart house
  • Optical sub-assembly (OSA)
  • Point-to-point networking
  • Wireless 3D game
  • Carrier phase observations
  • Sensor reporting

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