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SN74CB3T16212DGGR

SN74CB3T16212DGGR

SN74CB3T16212DGGR

Texas Instruments

56 Terminations2.3V~3.6V 56 Pin 74CB3T16212 Signal switch74CB Series 12 Functions

SOT-23

SN74CB3T16212DGGR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 56-TFSOP (0.240, 6.10mm Width)
Number of Pins 56
Weight 252.792698mg
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Series 74CB
JESD-609 Code e4
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 56
ECCN Code EAR99
Type Bus FET Exchange Switch
Resistance 8.5Ohm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory Other Logic ICs
Packing Method TR
Technology CMOS
Voltage - Supply 2.3V~3.6V
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 12
Supply Voltage 2.5V
Terminal Pitch0.5mm
Base Part Number 74CB3T16212
Pin Count56
Circuit 12 x 2:2
Polarity Non-Inverting
Supply Voltage-Max (Vsup) 3.6V
Power Supplies2.5/3.3V
Supply Voltage-Min (Vsup) 2.3V
Number of Ports4
Nominal Supply Current70μA
Output Current64mA
Number of Bits 2
Throw Configuration DPDT
Propagation Delay15.5 ns
Quiescent Current70μA
Turn On Delay Time15.5 ns
Family CB3T/3VT
Number of Inputs 24
Output Characteristics 3-STATE
Supply Type Single
Bandwidth 100MHz
Max I(ol) 0.007 A
Prop. [email protected] 0.25 ns
High Level Output Current-128mA
Low Level Output Current128mA
Power Supply Current-Max (ICC) 0.02mA
Voltage Supply SourceSingle Supply
Independent Circuits 1
Count Direction BIDIRECTIONAL
Translation N/A
Height 1.2mm
Length 14mm
Width 6.1mm
Thickness 1.15mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:7346 items

Pricing & Ordering

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SN74CB3T16212DGGR Product Details

SN74CB3T16212DGGR Overview


In order to conserve board space, digital switch is included in the 56-TFSOP (0.240, 6.10mm Width).The package is packaged in accordance with Tape & Reel (TR).Surface Mount is the mounting method digital switch ic uses.In the multiplexers, the analog IC is indicated by Bus FET Exchange Switch.A temperature of -40°C~85°C will not leave the turn signal swturn signal switchch susceptible to external influences.With a supply voltage of 2.3V~3.6V, designers have greater flexibility of digital controlled switch.Multiplexers of the 74CB series can be used in a wide range of applications.It is designed with 56 terminations as part of its basic configuration.You can also find related parts by using its logic switch base part number of 74CB3T16212.The turn signal switch is supplied with a voltage of 2.5V volts.There are 56 component pins in this turn signal switch.Conductors terminate at GULL WING in this design.Its supply type is Single, which is used as the source of power.It is configured with 56 pins.The mounting is in the way of Surface Mount.The CB3T/3VT family includes the logic switch.There are 2 bits in signal multiplexer.Vsup should be kept at 2.3V to prevent some unnecessary failures.To avoid unnecessary failures, the maximum supply voltage (Vsup) should be kept at 3.6V.mux switch's normal operation requires the power supply of 2.5/3.3V.This is a signal switch that is categorized as Other Logic ICs.Without external influences, it consumes 70μA current of multiplexer ic.This multiplexer has a total of 24 inputs.According to TR, the switches is packaged.The system operates with a resistance of 4.The resistance of the signal switching is 8.5Ohm.It is possible to provide a current output of 64mA for greater switches' flexibility.

SN74CB3T16212DGGR Features


Supplied in the 56-TFSOP (0.240, 6.10mm Width) package
Adopting a supply type of Single
Power supplies of 2.5/3.3V

SN74CB3T16212DGGR Applications


There are a lot of Texas Instruments SN74CB3T16212DGGR Signal Switches / Multiplexers / Decoders applications.

  • Enabling different functions units in microprocessor instruction decoding
  • To select different task for memory in microprocessor memory systems
  • Code conversion
  • Image transmission
  • Enabling different rows of memory depending on address in memory chips
  • Audio transmission
  • D/A converters
  • Data distribution
  • Enabling block of memory depending on address in memory chips
  • Recording transmission

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