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OMAP5910JGDY2

OMAP5910JGDY2

OMAP5910JGDY2

Texas Instruments

1mm ARM9TDMI 16-bit Microprocessor OMAP-59xx Series OMAP5910 289-Pin 150MHz 1.6V 289-BGA

SOT-23

OMAP5910JGDY2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Package / Case 289-BGA
Number of Pins 289
Operating Temperature-40°C~85°C TC
PackagingTray
Series OMAP-59xx
JESD-609 Code e0
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 289
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code8542.31.00.01
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 1.6V
Terminal Pitch1mm
Frequency 150MHz
Base Part Number OMAP5910
Pin Count289
Operating Supply Voltage1.6V
Voltage 1.675V
Interface I2C, MMC, SDIO, UART, USB
Memory Size32kB
Nominal Supply Current170mA
RAM Size 160kB
Memory TypeFLASH
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, MIXED
Core Processor ARM9TDMI
Bit Size 16
Data Bus Width 32b
Number of Timers/Counters 6
Address Bus Width25
Core Architecture ARM
On Chip Program ROM Width 16
Boundary Scan YES
Low Power Mode YES
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.75V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics AccelerationNo
RAM Controllers SDRAM
USB USB 2.0 (2)
Additional Interfaces 1-Wire/HDQ, AC97, I2C, I2S, IrDA, McBSP, MCSI, MICROWIRE, MMC/SD, SPI, UART
Co-Processors/DSP Signal Processing; C55x, System Control; CP15
ROM Programmability MROM
Barrel Shifter NO
Internal Bus Architecture MULTIPLE
Display & Interface ControllersKeypad, LCD
Number of DMA Channels 6
Length 19mm
Height Seated (Max) 2.32mm
RoHS StatusNon-RoHS Compliant
Lead Free Contains Lead
In-Stock:169 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$51.38000$51.38
10$47.93900$479.39
84$45.92964$3858.08976
168$41.62369$6992.77992

OMAP5910JGDY2 Product Details

OMAP5910JGDY2 Description


The OMAP5910JGDY2 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices. The OMAP? platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution. The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating an OMAP5910JGDY2 DSP core and a high-performance TI925T ARM core. The OMAP5910JGDY2 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS? software kernel foundation, and is available in a 289-ball MicroStar BGA? package.



OMAP5910JGDY2 Features


  • Low-Power, High-Performance CMOS Technology

  • TI925T (MPU) ARM9TDMI? Core

  • 192K Bytes of Shared Internal SRAM

  • Memory Traffic Controller (TC)

  • 9-Channel System DMA Controller

  • DSP Memory Management Unit

  • Endianism Conversion Logic



OMAP5910JGDY2 Applications


  • Applications processing devices

  • Mobile communications

  • Video and image processing (MPEG4, JPEG, Windows? Media Video, etc.)

  • Advanced speech applications (text-to-speech, speech recognition)

  • Audio processing

  • Graphics and video acceleration

  • Generalized web access

  • Data processing


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