DLP660TEFYG Overview
It can be seen that the ICs has been enclosed within the package 350-BFCPGA.Contains this module is the package Tray.The way of mounting integrated circuit is Through Hole.Various integrated circuits use this type of Digital Micromirror Device (DMD).Search the DLP660 family for similar integrated circuit systems.350 terminations were found on the ICs solutions.In the ICs applications, there are 350 pins.Temperatures below 90°C should be used.In this integrated circuit system, the minimum supply voltage (Vsup) should not be less than 1.65V.Maximum supply voltage (Vsup) for this application specific integrated circuit should not exceed 1.95V.
DLP660TEFYG Features
DLP660TEFYG Applications
There are a lot of Texas Instruments DLP660TEFYG Specialized ICs applications.
- Industrial Networks
- All AC-DC converters with X capacitors of 100 nF up to 6 mF
- All converters requiring very low standby power
- Ecosystem Control
- μP Switch Interfacing
- Industrial Instruments
- Membrane Keypads
- Portable Instruments
- Printer Cartridge Identification and Authentication
- Secure Download and Boot
