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DLP660TEAAFYG

DLP660TEAAFYG

DLP660TEAAFYG

Texas Instruments

350 TerminationsDigital Micromirror Device (DMD) DLP660 Specialized ICs1 Functions

SOT-23

DLP660TEAAFYG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Through Hole
Package / Case 350-BFCPGA
Surface MountNO
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 350
Type Digital Micromirror Device (DMD)
Terminal Position PERPENDICULAR
Terminal FormPIN/PEG
Number of Functions 1
Terminal Pitch1.27mm
Base Part Number DLP660
JESD-30 Code R-CPGA-P350
Operating Temperature (Max) 90°C
Supply Voltage-Max (Vsup) 1.95V
Temperature GradeOTHER
Supply Voltage-Min (Vsup) 1.65V
Height Seated (Max) 5.083mm
Length 35mm
Width 32mm
RoHS StatusROHS3 Compliant
In-Stock:51 items

Pricing & Ordering

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DLP660TEAAFYG Product Details

DLP660TEAAFYG Overview


There is a package 350-BFCPGA containing the ICs.This module is included in a package named Tray.Integrated circuit is mounted using the way of Through Hole.Various integrated circuits use this type of Digital Micromirror Device (DMD).The DLP660 family can be searched for similar integrated circuit systems.350 terminations were found on the ICs solutions.Temperatures below 90°C are recommended for integrated circuit systems use.Vsup should not be less than 1.65V as the minimum supply voltage for this integrated circuit system.Ensure that the maximum supply voltage (Vsup) for this application specific integrated circuit does not exceed 1.95V.

DLP660TEAAFYG Features



DLP660TEAAFYG Applications


There are a lot of Texas Instruments DLP660TEAAFYG Specialized ICs applications.

  • Portable Instruments
  • All converters requiring very low standby power
  • Lossless generation of zero crossing signal
  • Anti-cloning
  • PDAs and Palmtop Devices
  • Cell Phones
  • Adapters requiring ultra low no-load consumption
  • μP Switch Interfacing
  • Membrane Keypads
  • PC-Based Instruments

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