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DAC715UBG4

DAC715UBG4

DAC715UBG4

Texas Instruments

DAC Voltage 2 B B 2.35mm μm 7.52mm mm

SOT-23

DAC715UBG4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case SOIC
Surface MountYES
Number of Pins 28
Weight 730.794007mg
JESD-609 Code e4
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 28
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 15V
Pin Count28
Output Type Voltage
Polarity Unipolar
Temperature GradeINDUSTRIAL
Interface Parallel
Power Dissipation-Max 600mW
Nominal Supply Current22mA
Number of Bits 16
Converter Type D/A CONVERTER
Supply Type Dual
Resolution 2 B
Sampling Rate100 ksps
Settling Time10 μs
Max Dual Supply Voltage16.5V
Power Consumption10mW
Integral Nonlinearity (INL) 2 LSB
Min Dual Supply Voltage 11.4V
Input Bit Code 2'S COMPLEMENT BINARY
Dual Supply Voltage 15V
Number of Converters 1
Conversion Rate100 ksps
Negative Supply Voltage-Nom -15V
Differential Nonlinearity 2 LSB
Height 2.35mm
Length 18mm
Width 7.52mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:3798 items

DAC715UBG4 Product Details

DAC715UBG4 Overview


The package that contains this software is called SOIC. In order for the device to operate, a supply voltage of 15V volts needs to be provided. In total, it has a total of 28 terminations. In this case, 28 pins are used in the design. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than -40°C is recommended. A total of 28 pins are included in this device.

DAC715UBG4 Features


SOIC package
28 pin count
28 pins


DAC715UBG4 Applications


There are a lot of Texas Instruments
DAC715UBG4 Digital to Analog Converters (DAC) applications.


  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:

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