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30-00650

30-00650

30-00650

Tensility International Corp

30-00650 datasheet pdf and Multiple Conductor Cables product details from Tensility International Corp stock available on our website

SOT-23

30-00650 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Conductor MaterialCopper, Tinned
Jacket (Insulation) Material Thermoplastic Polyurethane (TPU)
Shield Material Copper, Tinned
Operating Temperature-40°C~70°C
PackagingSpool
Published 2016
Feature Biological Compatibility
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Conductors 2
Wire Gauge32 AWG
Voltage 150V
Cable TypeMulti-Conductor
Jacket Color Black
Conductor Strand19/0.0019
Jacket (Insulation) Diameter 0.095 (2.41mm)
Conductor Insulation High Density Polyethylene (HDPE)
Shield Type Spiral
Shield Coverage 90%
Length 1000.0' 304.8m
Jacket (Insulation) Thickness 0.0197 0.500mm
RoHS StatusROHS3 Compliant
Ratings ISO 10993
In-Stock:59 items

Pricing & Ordering

QuantityUnit PriceExt. Price
15$339.53400$5093.01

About 30-00650

The 30-00650 from Tensility International Corp is a high-performance microcontroller designed for a wide range of embedded applications. This component features 30-00650 datasheet pdf and Multiple Conductor Cables product details from Tensility International Corp stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 30-00650, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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