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PC755BMGSU300LE

PC755BMGSU300LE

PC755BMGSU300LE

Teledyne e2v

Microprocessor

SOT-23

PC755BMGSU300LE Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) 3A001.a.2.c
HTS 8542.31.00.01
Family Name PowerPC 755 Processor
Instruction Set Architecture RISC
Number of CPU Cores 1
Data Bus Width (bit) 32
Instruction Cache Size 32KB
Maximum Speed (MHz) 300
UART 0
USART 0
Data Cache Size 32KB
Multiply Accumulate No
I2C 0
I2S 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 2.1
I/O Voltage (V) 2.5|3.3
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Military
Standard Package Name CGA
Supplier Package CI-CGA
Mounting Surface Mount
Package Height 4.08 - 1.7(Max)
Package Length 25
Package Width 25
PCB changed 360
Part StatusObsolete
Pin Count360
Ethernet 0
USB 0
SPI 0
Device CorePowerPC
RoHS StatusRoHS non-compliant
In-Stock:1063 items

PC755BMGSU300LE Product Details

PC755BMGSU300LE Overview


A total of 360 pins are injected into the CPU microprocessor's body.

PC755BMGSU300LE Features




PC755BMGSU300LE Applications


There are a lot of Teledyne e2v
PC755BMGSU300LE Microprocessor applications.


  • Equipment control
  • Instrument control
  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle

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