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RP73UTPF1E24R9BTDF

RP73UTPF1E24R9BTDF

RP73UTPF1E24R9BTDF

TECONNECTIVITYPASSIVEPRODUCT

RP73UTPF1E24R9BTDF datasheet pdf and Buzzer Elements, Piezo Benders product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website

SOT-23

RP73UTPF1E24R9BTDF Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time NRND (Last Updated: 1 week ago)
Lifecycle Status 11 Weeks
Mount Flanges
Mounting Type Cable, Free Hanging
Package / Case SOIC
Number of Pins 8
Operating Temperature -
Packaging Box
Pbfree Code -
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1
Number of Terminations 2
ECCN Code -
Temperature Coefficient -
Subcategory -
Voltage - Supply 20V ~ 50V
Base Part Number Vapp Rxghe
Output Voltage 78 V
Output Type Transistor Driver
Interface -
Termination Type SOLDER
Operating Supply Current 700 μA
Nominal Supply Current 1.5 mA
Output Current 60 mA
Max Supply Current 1 mA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:4836 items

About RP73UTPF1E24R9BTDF

The RP73UTPF1E24R9BTDF from TECONNECTIVITYPASSIVEPRODUCT is a high-performance microcontroller designed for a wide range of embedded applications. This component features RP73UTPF1E24R9BTDF datasheet pdf and Buzzer Elements, Piezo Benders product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RP73UTPF1E24R9BTDF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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