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2217UT60883

2217UT60883

2217UT60883

TECONNECTIVITYPASSIVEPRODUCT

2217UT60883 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website

SOT-23

2217UT60883 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time ACTIVE (Last Updated: 2 days ago)
Lifecycle Status 10 Weeks
Mount Through Hole
Mounting Type Surface Mount
Package / Case SOT-23
Number of Pins 3
Operating Temperature 0°C ~ 125°C
Packaging Bulk
Pbfree Code -
Part Status Active
Moisture Sensitivity Level (MSL) -
Number of Terminations 3
ECCN Code -
Temperature Coefficient -
Subcategory Other Regulators
Voltage - Supply 10V ~ 40V
Base Part Number Nsoruc Sjgdcv
Output Voltage 78 V
Output Type Transistor Driver
Interface I2C, SPI
Termination Type -
Operating Supply Current 10 mA
Nominal Supply Current 1 mA
Output Current 10 mA
Max Supply Current 80 μA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:2233 items

About 2217UT60883

The 2217UT60883 from TECONNECTIVITYPASSIVEPRODUCT is a high-performance microcontroller designed for a wide range of embedded applications. This component features 2217UT60883 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYPASSIVEPRODUCT stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 2217UT60883, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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