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92UT80371

92UT80371

92UT80371

TECONNECTIVITYAMPCONNECTORS

92UT80371 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYAMPCONNECTORS stock available on our website

SOT-23

92UT80371 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time LAST SHIPMENTS (Last Updated: 4 days ago)
Lifecycle Status -
Mount Press Fit, Through Hole
Mounting Type Surface Mount
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 3
Operating Temperature 0°C ~ 70°C
Packaging Bulk
Pbfree Code yes
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient -
Subcategory Operational Amplifier
Voltage - Supply -
Base Part Number Boiog Hrzr
Output Voltage 84 V
Output Type Analog Voltage
Interface -
Termination Type SOLDER
Operating Supply Current 10 mA
Nominal Supply Current 1 μA
Output Current -
Max Supply Current 80 μA
Slew Rate 0.1V/μs
Architecture -
Amplifier Type -
In-Stock:2669 items

About 92UT80371

The 92UT80371 from TECONNECTIVITYAMPCONNECTORS is a high-performance microcontroller designed for a wide range of embedded applications. This component features 92UT80371 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYAMPCONNECTORS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 92UT80371, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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