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3156UT45281

3156UT45281

3156UT45281

TECONNECTIVITYAMPCONNECTORS

3156UT45281 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYAMPCONNECTORS stock available on our website

SOT-23

3156UT45281 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time LAST SHIPMENTS (Last Updated: 4 days ago)
Lifecycle Status -
Mount -
Mounting Type Flanges
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 6
Operating Temperature -55°C ~ 150°C
Packaging Box
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 6
ECCN Code EAR99
Temperature Coefficient POSITIVE ppm/°C
Subcategory Other Sensors/Transducers
Voltage - Supply 10V ~ 40V
Base Part Number Habps Wbury
Output Voltage 76 V
Output Type P-Channel
Interface -
Termination Type SOLDER
Operating Supply Current 1 μA
Nominal Supply Current 10 mA
Output Current 80 mA
Max Supply Current -
Slew Rate 0.1V/μs
Architecture -
Amplifier Type -
In-Stock:3597 items

About 3156UT45281

The 3156UT45281 from TECONNECTIVITYAMPCONNECTORS is a high-performance microcontroller designed for a wide range of embedded applications. This component features 3156UT45281 datasheet pdf and Evaluation, Development Board Enclosures product details from TECONNECTIVITYAMPCONNECTORS stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 3156UT45281, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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