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V2-14.0-0-FSP-SM

V2-14.0-0-FSP-SM

V2-14.0-0-FSP-SM

TE Connectivity Raychem Cable Protection

Heat Shrink Tubing ST Polyolefin Black Thin Flat Spooled

SOT-23

V2-14.0-0-FSP-SM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Material Polyolefin (PO)
Body Material Polyolefin
Operating Temperature-30°C~125°C
PackagingSpool
Series Versafit; V2
Feature Flame Retardant
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Tubing, Flexible
Max Operating Temperature125°C
Min Operating Temperature -30°C
Color Black
ELV Compliant
Shrinkage Ratio 2 to 1
Shrink Temperature70°C
Length 164.0' 50.0m
Diameter - Inside 14.4 mm
Diameter - Inner, Supplied 0.567 (14.40mm)
Diameter - Inner, Recovered 0.275 (6.99mm)
Recovered Wall Thickness 0.027 0.69mm
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:117 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$107.547305$107.547305
10$101.459722$1014.59722
100$95.716718$9571.6718
500$90.298790$45149.395
1000$85.187539$85187.539

About V2-14.0-0-FSP-SM

The V2-14.0-0-FSP-SM from TE Connectivity Raychem Cable Protection is a high-performance microcontroller designed for a wide range of embedded applications. This component features Heat Shrink Tubing ST Polyolefin Black Thin Flat Spooled.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the V2-14.0-0-FSP-SM, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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