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V2-11.0-0-FSP-SM

V2-11.0-0-FSP-SM

V2-11.0-0-FSP-SM

TE Connectivity Raychem Cable Protection

Heat Shrink Tubing ST Polyolefin Black Thin Flat Spooled

SOT-23

V2-11.0-0-FSP-SM Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 17 Weeks
Lifecycle Status ACTIVE (Last Updated: 2 days ago)
Material Polyolefin (PO)
Body Material Polyolefin
Operating Temperature-30°C~125°C
PackagingSpool
Series Versafit; V2
Feature Flame Retardant
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Tubing, Flexible
Max Operating Temperature125°C
Min Operating Temperature -30°C
Color Black
ELV Compliant
Shrinkage Ratio 2 to 1
Shrink Temperature70°C
Length 164.0' 50.0m
Diameter - Inside 11.4 mm
Diameter - Inner, Supplied 0.450 (11.43mm)
Diameter - Inner, Recovered 0.217 (5.51mm)
Recovered Wall Thickness 0.022 0.56mm
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:180 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$56.91000$56.91
5$53.35600$266.78
10$49.79800$497.98
20$47.30800$946.16
50$46.24100$2312.05
100$45.17390$4517.39

About V2-11.0-0-FSP-SM

The V2-11.0-0-FSP-SM from TE Connectivity Raychem Cable Protection is a high-performance microcontroller designed for a wide range of embedded applications. This component features Heat Shrink Tubing ST Polyolefin Black Thin Flat Spooled.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the V2-11.0-0-FSP-SM, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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