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V23030A2014A104

V23030A2014A104

V23030A2014A104

TE Connectivity Potter & Brumfield Relays

RELAY GEN PURPOSE 4PDT 2A 60VDC

SOT-23

V23030A2014A104 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialSilver (Ag), Gold (Au)
Mounting Type Through Hole
Surface MountNO
Operating Temperature-40°C~70°C
PackagingBulk
Published 2012
Series V23030, AXICOM
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Reference Standard UL
Termination Style PC Pin
Body Length or Diameter 39.7mm
Body Breadth 32.4 mm
Physical Dimension 39.7mm x 32.4mm x 10.2mm
Sealing DUST PROOF
Contact Form4PDT (4 Form C)
Relay Type General Purpose
Coil Resistance4.1kOhm
Operate Time8ms
Coil Voltage 60VDC
Coil TypeNon Latching
Switching Voltage250VAC 250VDC -Max
Coil Current14.6mA
Release Time2ms
Must Operate Voltage 38VDC
Contact Rating (Current) 2A
Coil Power 880mW
Contact/Output Supply Type AC/DC
Relay Action MOMENTARY
Coil/Input Supply Type DC
Body Height 10.2mm
RoHS StatusRoHS Compliant
In-Stock:94 items

Pricing & Ordering

QuantityUnit PriceExt. Price
20$113.22000$2264.4

About V23030A2014A104

The V23030A2014A104 from TE Connectivity Potter & Brumfield Relays is a high-performance microcontroller designed for a wide range of embedded applications. This component features RELAY GEN PURPOSE 4PDT 2A 60VDC.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the V23030A2014A104, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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