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T7NS1D1-12

T7NS1D1-12

T7NS1D1-12

TE Connectivity Potter & Brumfield Relays

RELAY GEN PURPOSE SPST 10A 12V

SOT-23

T7NS1D1-12 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialSilver Cadmium Oxide (AgCdO)
Mount Through Hole
Mounting Type Through Hole
Number of Pins 4
Operating Temperature-40°C~85°C
PackagingTube
Published 2011
Series T7N
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination PC Pin
Max Operating Temperature85°C
Min Operating Temperature -40°C
Termination Style PC Pin
ELV Non-Compliant
Max Voltage Rating (AC) 400V
Max Current Rating 35A
Throw Configuration SPST
Contact FormSPST-NO (1 Form A)
Relay Type General Purpose
Coil Resistance400Ohms
Operate Time9ms
Coil Voltage 12VDC
Coil TypeNon Latching
Switching Voltage240VAC 28VDC -Max
Coil Current30mA
Release Time5ms
Must Operate Voltage 8.4VDC
Contact Rating (Current) 10A
Power Consumption45mW
Coil Power 360mW
Must Release Voltage 1.2VDC
Coil Voltage (DC) 12V
Seal Rating Sealed - Fully
Coil Insulation Class F
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:3787 items

About T7NS1D1-12

The T7NS1D1-12 from TE Connectivity Potter & Brumfield Relays is a high-performance microcontroller designed for a wide range of embedded applications. This component features RELAY GEN PURPOSE SPST 10A 12V.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T7NS1D1-12, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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