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4700-26EW30BB999

4700-26EW30BB999

4700-26EW30BB999

TE Connectivity Potter & Brumfield Relays

XFRMR LAMINATED 80VA CHAS MOUNT

SOT-23

4700-26EW30BB999 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mounting Type Chassis Mount
Published 2004
Series 4700, Products Unlimited
Size / Dimension 101.60mm Lx63.50mm W
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Laminated Core
Termination Style Solder, Quick Connect
Power - Max 80VA
Voltage - Primary 240V 575V
Primary Winding(s) Single
Center TapNo
Voltage - Secondary (Full Load) 120V
RoHS StatusRoHS Compliant
In-Stock:3918 items

Pricing & Ordering

QuantityUnit PriceExt. Price
100$21.00000$2100

About 4700-26EW30BB999

The 4700-26EW30BB999 from TE Connectivity Potter & Brumfield Relays is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 80VA CHAS MOUNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4700-26EW30BB999, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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