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4700-09K18BB999

4700-09K18BB999

4700-09K18BB999

TE Connectivity Potter & Brumfield Relays

XFRMR LAMINATED 100VA CHAS MOUNT

SOT-23

4700-09K18BB999 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mounting Type Chassis Mount
Published 2005
Series 4700, Products Unlimited
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Laminated Core
Termination Style Solder, Quick Connect
Power - Max 100VA
Voltage - Primary 208V 240V
Primary Winding(s) Single
Center TapNo
Voltage - Secondary (Full Load) 24V
RoHS StatusRoHS Compliant
In-Stock:2311 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$42.16000$42.16
10$37.20000$372
25$35.96000$899
50$32.24000$1612
100$31.00000$3100

About 4700-09K18BB999

The 4700-09K18BB999 from TE Connectivity Potter & Brumfield Relays is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 100VA CHAS MOUNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4700-09K18BB999, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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