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4000-01M04K999

4000-01M04K999

4000-01M04K999

TE Connectivity Potter & Brumfield Relays

XFRMR LAMINATED 30VA CHAS MOUNT

SOT-23

4000-01M04K999 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Mount Chassis Mount, Flanges
Mounting Type Chassis Mount
Number of Pins 5
Weight 1.2lbs 544.3g
PackagingBulk
Published 2005
Series 4000, Products Unlimited
Size / Dimension 82.55mm Lx54.61mm W
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Wire Leads
ECCN Code EAR99
Type Laminated Core
Power Rating 30W
Max Power Dissipation30W
Termination Style Wire Leads
ELV Compliant
Power - Max 30VA
Primary Winding(s) Single
Center TapNo
Voltage - Secondary (Full Load) 24V
Nominal Primary Voltage 120V
Nominal Secondary Voltage 24V
Height Seated (Max) 47.75mm
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:471 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$18.84000$18.84
10$16.62000$166.2
25$16.06600$401.65
50$14.40400$720.2
100$13.85000$1385

About 4000-01M04K999

The 4000-01M04K999 from TE Connectivity Potter & Brumfield Relays is a high-performance microcontroller designed for a wide range of embedded applications. This component features XFRMR LAMINATED 30VA CHAS MOUNT.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4000-01M04K999, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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