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RP73D2B590KBTDF

RP73D2B590KBTDF

RP73D2B590KBTDF

TE Connectivity Passive Product

Thin Film Resistors RP 2B 590K 0.1% 15PPM 1K RL

SOT-23

RP73D2B590KBTDF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Contact PlatingTin
Mount Surface Mount
Package / Case 1206 (3216 Metric)
Supplier Device Package 1206
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2007
Series RP73, Holsworthy
Size / Dimension 0.120Lx0.061W 3.05mmx1.55mm
Tolerance ±0.1%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Solder
Temperature Coefficient±15ppm/°C
Resistance 590kOhms
Max Operating Temperature155°C
Min Operating Temperature -55°C
Composition Thin Film
Power (Watts) 0.25W 1/4W
Voltage - Rated 200V
Power Rating 250mW
Case Code (Metric) 3216
Case Code (Imperial) 1206
ELV Compliant
Number of Resistors 1
Height Seated (Max) 0.026 0.65mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:24250 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About RP73D2B590KBTDF

The RP73D2B590KBTDF from TE Connectivity Passive Product is a high-performance microcontroller designed for a wide range of embedded applications. This component features Thin Film Resistors RP 2B 590K 0.1% 15PPM 1K RL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RP73D2B590KBTDF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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