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RN73C2A12KBTDF

RN73C2A12KBTDF

RN73C2A12KBTDF

TE Connectivity Passive Product

Thin Film Resistors RN 0805 12K 0.1% 10PPM 1KRL

SOT-23

RN73C2A12KBTDF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Package / Case 0805 (2012 Metric)
Surface MountYES
Terminal Shape WRAPAROUND
Mounting FeatureSURFACE MOUNT
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2007
Series RN73, Holsworthy
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
Tolerance ±0.1%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±10ppm/°C
Resistance 12kOhm
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Composition Thin Film
Power (Watts) 0.1W 1/10W
Additional FeatureHIGH PRECISION
Packing Method TR, PAPER, 7 INCH
Construction RECTANGULAR PACKAGE
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 0.1W
Working Voltage 100V
Height Seated (Max) 0.026 0.65mm
RoHS StatusRoHS Compliant
In-Stock:17135 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About RN73C2A12KBTDF

The RN73C2A12KBTDF from TE Connectivity Passive Product is a high-performance microcontroller designed for a wide range of embedded applications. This component features Thin Film Resistors RN 0805 12K 0.1% 10PPM 1KRL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the RN73C2A12KBTDF, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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