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MGDQ6-00009-P

MGDQ6-00009-P

MGDQ6-00009-P

TE Connectivity Passive Product

Ind Power Shielded Wirewound 10uH 5.4A

SOT-23

MGDQ6-00009-P Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case Nonstandard
Surface MountYES
Terminal Shape WRAPAROUND
Shape/Size Description RECTANGULAR PACKAGE
Operating Temperature-40°C~85°C
Published 2007
Series MGDQ6, Coev
Size / Dimension 0.492Lx0.492W 12.50mmx12.50mm
Tolerance ±20%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
HTS Code8504.50.80.00
Shielding Unshielded
Number of Functions 1
Inductance 10μH
DC Resistance (DCR) 22mOhm
Inductor Application POWER INDUCTOR
Terminal Placement DUAL ENDED
Inductance Frequency - Test 100kHz
Inductor Type GENERAL PURPOSE INDUCTOR
Current - Saturation 5.4A
Rated Current-Max 5.4A
Height Seated (Max) 0.315 8.00mm
RoHS StatusRoHS Compliant
In-Stock:5583 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.60000$1.6
500$1.584$792
1000$1.568$1568
1500$1.552$2328
2000$1.536$3072
2500$1.52$3800

About MGDQ6-00009-P

The MGDQ6-00009-P from TE Connectivity Passive Product is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ind Power Shielded Wirewound 10uH 5.4A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MGDQ6-00009-P, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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