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H4P180KFDA

H4P180KFDA

H4P180KFDA

TE Connectivity Passive Product

Metal Film Resistors H4P 180K 1% 25PPM

SOT-23

H4P180KFDA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact PlatingTin
Mount Axial, Through Hole
Package / Case Axial
Terminal Shape WIRE
Weight 400.011771mg
Operating Temperature-55°C~155°C
PackagingBulk
Published 2007
Series Holco, Holsworthy
Size / Dimension 0.146Diax0.394L 3.70mmx10.00mm
Tolerance ±1%
Feature Pulse Withstanding
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient±25ppm/°C
Resistance 180kOhm
Composition Metal Film
Voltage - Rated 500V
Additional FeaturePRECISION
Subcategory Fixed Resistors
Power Rating 1W
Packing Method TAPE
Max Power Dissipation1W
Technology THIN FILM
Resistor Type FIXED RESISTOR
Rated Power Dissipation (P) 1W
ELV Compliant
Number of Resistors 1
Diameter 3.7mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:13534 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$0.54164$270.82

About H4P180KFDA

The H4P180KFDA from TE Connectivity Passive Product is a high-performance microcontroller designed for a wide range of embedded applications. This component features Metal Film Resistors H4P 180K 1% 25PPM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the H4P180KFDA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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