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CPF0603F169KC1

CPF0603F169KC1

CPF0603F169KC1

TE Connectivity Passive Product

Res Thin Film 0603 169K Ohm 1% 1/16W ±50ppm/°C Molded SMD SMD Paper T/R

SOT-23

CPF0603F169KC1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 13 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Mount Surface Mount
Package / Case 0603 (1608 Metric)
Supplier Device Package 0603
Weight 2.012816mg
Operating Temperature-55°C~155°C
PackagingTape & Reel (TR)
Published 2007
Series CPF, Neohm
Size / Dimension 0.061Lx0.031W 1.55mmx0.80mm
Tolerance ±1%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Solder
Temperature Coefficient±50ppm/°C
Resistance 169kOhms
Max Operating Temperature155°C
Min Operating Temperature -55°C
Composition Thin Film
Power (Watts) 0.063W 1/16W
Voltage - Rated 50V
Power Rating 63mW
Max Power Dissipation63mW
Case Code (Metric) 1608
Case Code (Imperial) 0603
ELV Compliant
Number of Resistors 1
Height 550μm
Height Seated (Max) 0.022 0.55mm
Length 1.5494mm
Width 787.4μm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:263348 items

Pricing & Ordering

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About CPF0603F169KC1

The CPF0603F169KC1 from TE Connectivity Passive Product is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Thin Film 0603 169K Ohm 1% 1/16W ±50ppm/°C Molded SMD SMD Paper T/R.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the CPF0603F169KC1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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