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808-AG12D-ES

808-AG12D-ES

808-AG12D-ES

TE Connectivity / Buchanan

808-AG12D-ES datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity / Buchanan stock available on our website

SOT-23

808-AG12D-ES Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialCopper
Contact PlatingLead, Tin
Mount Vertical
Housing Material Polyester
Pbfree Code no
Termination Through Hole
ECCN Code EAR99
Number of Positions 8
Max Operating Temperature105°C
Min Operating Temperature -55°C
Contact Finish - Mating NOT SPECIFIED
Pitch 2.54mm
Current Rating3A
Body Length or Diameter 0.4 inch
Row Spacing - Mating 7.62 mm
Number of Contacts 8
PCB Contact Pattern RECTANGULAR
Lead Length 3.18mm
Contact Style RND PIN-SKT
Contact Resistance 10mOhm
Insulation Resistance5GOhm
ELV Non-Compliant
PCB Contact Row Spacing 0.3 mm
Device Socket Type IC SOCKET
RoHS StatusNon-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Contains Lead
In-Stock:1316 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 808-AG12D-ES

The 808-AG12D-ES from TE Connectivity / Buchanan is a high-performance microcontroller designed for a wide range of embedded applications. This component features 808-AG12D-ES datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity / Buchanan stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 808-AG12D-ES, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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