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92007-1

92007-1

92007-1

TE Connectivity AMP Connectors

Headers & Wire Housings CMPSNP CONT. METINTERCONN SYS.

SOT-23

92007-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 11 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact MaterialBronze
Mount Cable
PackagingTape & Reel (TR)
Published 1997
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Max Operating Temperature105°C
Min Operating Temperature -25°C
HTS Code8536.90.40.00
Orientation Straight
Shielding Unshielded
Current Rating2A
Contact Finish Tin
Contact Gender Female
Wire Gauge22-30 AWG
Insulation Resistance1GOhm
ELV Compliant
Wire/Cable Type Discrete
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 30 AWG
Wire/Cable Gauge 30 AWG
Sealable No
Circuit Application Signal
Terminal and Terminal Block Type WIRE TERMINAL
Contact Termination Crimp
Insulation Diameter 1.9 mm
Wire Cross Section 0.35 mm2
Pin or Socket Socket
Length 7.72mm
Plating Thickness 800 nm
RoHS StatusRoHS Compliant
Lead Free Not Applicable
In-Stock:71631 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 92007-1

The 92007-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Headers & Wire Housings CMPSNP CONT. METINTERCONN SYS..

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 92007-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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