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846793-2

846793-2

846793-2

TE Connectivity AMP Connectors

Conn LGH RCP 1 POS ST Panel Mount 1 Terminal 1 Port

SOT-23

846793-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Contact PlatingGold
Mount Panel
Mounting Type Panel Mount
Shell Material Glass
Weight 23g
Shape Circular
PackagingBulk
Published 2011
Feature Flange
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 1
Termination Through Hole
Connector Type Adapter
Max Operating Temperature125°C
Min Operating Temperature -55°C
Voltage - Rated 20kV
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Orientation Straight
Depth 31.75mm
Style LGH 1
Voltage 20kVDC
ELV Compliant
Assembly Length 47.752mm
Barrel Depth 0.88 22.35mm
Length 47.75mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:71 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$485.080505$485.080505
10$457.623118$4576.23118
100$431.719922$43171.9922
500$407.282946$203641.473
1000$384.229194$384229.194

About 846793-2

The 846793-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Conn LGH RCP 1 POS ST Panel Mount 1 Terminal 1 Port.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 846793-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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