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8080-1G1

8080-1G1

8080-1G1

TE Connectivity AMP Connectors

8080-1G1 datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

8080-1G1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 5 Weeks
Mounting Type Through Hole
Housing Material Fluoropolymer (FP)
Number of Positions or Pins (Grid) 4 (Round)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Operating Temperature-55°C~125°C
PackagingBulk
Series 8080
Published 2011
Feature Closed Frame
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type Transistor, TO-3
HTS Code8536.69.40.40
Contact Finish - Mating Gold
Number of Contacts 3
Contact Finish - Post Tin-Lead
RoHS StatusNon-RoHS Compliant
In-Stock:603 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$14.550000$14.55
10$13.726415$137.26415
100$12.949448$1294.9448
500$12.216461$6108.2305
1000$11.524963$11524.963

About 8080-1G1

The 8080-1G1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 8080-1G1 datasheet pdf and Sockets for ICs, Transistors product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 8080-1G1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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