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66332-4

66332-4

66332-4

TE Connectivity AMP Connectors

66332-4 datasheet pdf and Contacts - Multi Purpose product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

66332-4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Lifecycle Status ACTIVE (Last Updated: 5 days ago)
Factory Lead Time 5 Weeks
Contact MaterialBrass
Contact PlatingTin
Mount Cable
Package / Case 062
Underplate Material Nickel
PackagingTape & Reel (TR)
Series Multimate III+
Published 2012
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Signal
Gender Male
Orientation Straight
Shielding Unshielded
Contact Finish Gold
Wire Gauge20-24 AWG
ELV Compliant
Max Current Rating 13A
Wire/Cable Type Discrete
Wire/Cable Gauge 20 AWG
Contact Termination Crimp
Test Current 13A
Insulation Diameter 2.54 mm
Pin or Socket Pin
Length 27.1mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 760 nm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:6565 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 66332-4

The 66332-4 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features 66332-4 datasheet pdf and Contacts - Multi Purpose product details from TE Connectivity AMP Connectors stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 66332-4, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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