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647466-2

647466-2

647466-2

TE Connectivity AMP Connectors

Headers & Wire Housings 3.96 EP HDR ASSY 2P R/A

SOT-23

647466-2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 19 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact MaterialBronze
Mount Cable
Underplate Material Nickel
PackagingTape & Reel (TR)
Published 2005
Series SL-156
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Power
Max Operating Temperature221°C
Min Operating Temperature -67°C
Orientation Straight
Shielding Unshielded
Current Rating10A
Contact Finish Gold
Operating Supply Voltage250V
Contact Style Standard
Wire Gauge16 AWG
ELV Compliant
Wire/Cable Type Discrete
Wire/Cable Gauge 16 AWG
Sealable No
Contact Current Rating10A
Contact Termination Crimp
Insulation Diameter 2.84 mm
Pin or Socket Socket
Length 13.3mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 760 nm
RoHS StatusRoHS Compliant
In-Stock:16367 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.682861$0.682861
10$0.644209$6.44209
100$0.607744$60.7744
500$0.573343$286.6715
1000$0.540890$540.89

About 647466-2

The 647466-2 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features Headers & Wire Housings 3.96 EP HDR ASSY 2P R/A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 647466-2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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