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6450839-7

6450839-7

6450839-7

TE Connectivity AMP Connectors

CONN HEADER MULTI-BEAM 40POS PCB

SOT-23

6450839-7 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 25 Weeks
Lifecycle Status ACTIVE (Last Updated: 3 days ago)
Contact PlatingTin
Mounting Type Through Hole, Right Angle
Housing Material Thermoplastic
Operating Temperature-20°C~105°C
PackagingTray
Published 2013
Series MULTI-BEAM XLE
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header, Male Pins and Blades
Number of Positions 40
Number of Rows 4
Pitch 0.100 2.54mm
Orientation Right Angle
Number of Positions Loaded 38
Current Rating75A
Contact Finish Gold
Housing Color Black
Operating Supply Voltage300V
Row Spacing2.54 mm
Connector Style Multi-Beam
Sealable No
Number of Power Positions 8
Number of Signal Positions 32
Contact Layout, Typical 32 Signal, 8 Power
Contact Retention Without
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 760 nm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:192 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 6450839-7

The 6450839-7 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER MULTI-BEAM 40POS PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 6450839-7, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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