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5822417-1

5822417-1

5822417-1

TE Connectivity AMP Connectors

CONN SKT SIMM 80POS PCB

SOT-23

5822417-1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 week ago)
Contact MaterialBronze
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole
Insulation Material Polymer
Housing Material Polymer
PackagingTube
Published 1997
Series Micro-Edge
Feature Board Guide, Latches
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 80
Max Operating Temperature105°C
Min Operating Temperature -55°C
Number of Rows 1
Pitch 1.27mm
Orientation Straight
Depth 8.51mm
Contact Finish Gold
Number of Contacts 80
Housing Color Natural
Lead Length 3.66mm
Insulation Resistance10GOhm
ELV Compliant
Max Current Rating 1A
Connector Style SIMM
Memory TypeRAM
Sealable No
Circuit Application Signal
Hole Diameter 1.63 mm
Standards MO-116
Length 125.73mm
Contact Finish Thickness 30.0μin 0.76μm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:603 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 5822417-1

The 5822417-1 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SKT SIMM 80POS PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5822417-1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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