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5822097-3

5822097-3

5822097-3

TE Connectivity AMP Connectors

CONN SKT SIMM 72POS PCB

SOT-23

5822097-3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 9 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Contact MaterialBronze
Contact PlatingGold
Mount Through Hole
Mounting Type Through Hole, 22° Angle
Mounting FeatureNormal, Standard - Top
Insulation Material Polymer
Housing Material Polymer
PackagingBox
Published 1997
Series Micro-Edge
Feature Board Guide, Latches
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder, Through Hole
Number of Positions 72
Max Operating Temperature105°C
Min Operating Temperature -55°C
Number of Rows 1
Pitch 1.27mm
Depth 13.72mm
Contact Finish Gold
Number of Contacts 72
Lead Length 2.921mm
ELV Compliant
Max Current Rating 1A
Connector Style SIMM
Memory TypeRAM
Sealable No
Circuit Application Signal
Hole Diameter 2.4384 mm
Length 115.32mm
Contact Finish Thickness 30.0μin 0.76μm
Length - Tail 2.92mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:869 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 5822097-3

The 5822097-3 from TE Connectivity AMP Connectors is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SKT SIMM 72POS PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 5822097-3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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